年度	2017
全部作者	邱俊诚, Y.-C. Hu, Y.-C. Huang, P.-T. Huang, S.-L. Wu, H.-C. Chang, Y.-T. Yang, Y.-H. You, J.-M. Chen, Y.-Y. Huang, Y.-H. Lin, J.-R. Duann, T.-W. Chiu, W. Hwang, C.-T. Chuang, J.-C. Chiou, and K.-N. Chen
论文名称	An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem
期刊名称	IEEE Transactions on Electron Devices
发表日期	2017-10-18
语言	中文