年度	2021
全部作者	廖育德,Shao-Yung Lu, Siang-Sin Shan, Shih-Che Kuo, Cheng-Ze Shao, Yung-Hua Yeh, I-Te Lin, Shu-Ping Lin, Yu-Te Liao
论文名称	A Wireless Multimodality System-on-a-Chip with Time-Based Resolution Scaling Technique for Chronic Wound Monitoring
会议名称	International Solid-State Circuits Conference (ISSCC)
地点	San Francisco
主办单位	IEEE
语言	中文